Why perform a surface analysis on your microelectronic components?
On the one hand, producers of electronic components or subcontractors in the microtechnology sector are faced with various specific problems. These are major since they can impact the safety and quality of products.
In order to better understand and control microelectronic products, these industrial actors analyze the surface of microelectronic components.
In this way, they are able to :
- Better control your raw materials
- Master the cleaning processes
- Qualify the conformity of your surface treatments
- Characterize production anomalies (defects, pollution, delamination, corrosion…)
To go further, knowing the surface properties of a microelectronic component allows to adapt and optimize the manufacturing processes.
Tailor-made support for microelectronics manufacturers in surface analysis
Whatever your problems related to the surface analysis of your microelectronic components, the FILAB laboratory offers you a tailor-made support.
For this purpose, different technical means are available to provide you with reliable and fast results:
- SEM-FEG EDX
- XPS
- TOF-SIMS
your issues
Fracture facies studyc
Adhesion problem
Metallographic examination
Analysis of contaminations or particles
Corrosion phenomenon
Weld analysis
