Non-destructive testing of electronic and optronic assemblies in the laboratory
Ensuring the integrity of systems without compromising their operation using a materials laboratory
Embedded electronic and optronic assemblies are often complex, miniaturized, and critical to system performance.
Non-destructive testing (NDT) allows for verification of the integrity of components and interfaces without damaging the boards or subassemblies.
This approach is essential for:
- Detecting defects before commissioning
- Preventing failures during operation
- Ensuring the safety of tests and qualifications
- Ensuring compliance with aeronautical and industrial standards
Services offered by the FILAB laboratory
Detection of cracks, porosity, and internal defects
Analysis of metallic and polymer interfaces
Inspection of complex electronic boards and optronic systems
Evaluation of adhesive and coating adhesion
Detection of delamination or micro-delamination areas
Inspection of surface treatments and protective coatings
X-ray tomography - non-destructive testing
This is a material analysis and testing technique that uses radiation/matter interaction.
It allows for the creation of 3D images of the object being studied.
X-ray tomography enables the analysis of a material’s composition, from its surface to its core, and the monitoring of its evolution under external stresses.
To go further
Why use FILAB?
- 45 years of expertise in materials analysis and testing
- Dual expertise in chemistry and materials
- Accredited by Safran, Dassault Aviation, and Framatome
FAQ
Yes. The analyses are performed according to ASTM, MIL-STD, IPC, ISO, RCTA DO standards, depending on the program requirements.
To obtain a quote, please contact us directly using the contact form on the right or call us to discuss your needs.
FILAB is a laboratory that supports its clients by offering analytical services tailored to your specific context:
- regulatory requirements,
- post-failure analysis,
- quality control, etc.
We perform a range of custom analyses.