As an aerospace or electronics manufacturer, you want to carry out an expert assessment using 3D X-ray scanning
3D X-ray scanning technology for the aerospace and electronics industries
First of all, 3D X-ray scanning or X-ray tomography is a technique for analysing and checking materials using radiation/matter interaction.
This analysis technique makes it possible to view the inside of an object without having to cut, dismantle or damage it. It provides a complete, three-dimensional and non-destructive view of the internal structure of a part, even a complex one.
3D X-ray scanning: a high-precision scanner for the aerospace and electronics industries
3D X-ray scanning is a non-destructive imaging technique that allows you to view the inside of a part in 3 dimensions with very high resolution. It gives you a complete map of your parts, without having to cut them up.
This analysis technique is used in a variety of sectors, from aerospace to electronics, to :
Accurately detect and locate internal defects (porosities, cracks, inclusions, etc.)
Checking material homogeneity
Measuring the 3 dimensions of a part
Measure volumes of defects or areas of interest (porosity volume, fill rate, etc.)
Compare a real part with its theoretical model
3D X-ray scanning: the challenges for aerospace and electronics manufacturers
Internal defects, porosity, inclusions on parts, deformation, welding problems… Parts used in the aerospace and electronics industries have to meet strict quality requirements.
These defects are often invisible to the naked eye and inaccessible to conventional analysis techniques. The 3d x-ray scanning technique overcomes this difficulty.
Common applications of 3D X-ray scanning technology
Aerospace
Qualification of batches or new suppliers
Non-conformity analysis (customer feedback, complaints)
Appraisal following a breakage or performance defect
R&D or process optimisation
Electronics
Inspection of surface-mounted components (checking welds, detecting cracks, analysing internal connectors)
Inspection of multilayer assemblies (printed circuit board inspection)
Dimensional and deformation analysis
Failure detection and analysis
Battery & micro-sensor control
The FILAB laboratory can provide you with expertise in 3D X-ray scanning for aerospace and electronics.
Why choose FILAB for a 3D X-ray scan?
The FILAB laboratory is equipped with high-resolution 3D X-ray scanning systems, capable of analysing parts of various sizes with great precision.
Our materials engineers, experts in aeronautics and electronics, have a thorough understanding of the processes used in these sectors and are able to communicate effectively with your teams.
As well as simply acquiring images, we provide a tailor-made interpretation of the results: a clear, usable report that is contextualised to your industrial challenges.
Finally, we are highly responsive. Aware that your needs can be critical, we adapt our deadlines to your production or qualification constraints.
Our other materials characterization methods
Characterization of materials: metals, polymers, ceramics, glass, composites, etc.
Surface analysis and coating characterization
Surface analysis by X-ray microtomography
Failure analysis: crack, rupture, corrosion, welds quality studies, etc.
FAQ
Depending on the type of equipment used, resolutions of the order of a few microns can be achieved. This makes it possible to visualise very fine details, such as bonding wires, internal vias or defects in welds.
Unlike techniques such as metallographic cutting or microetching, 3D X-ray scanning is entirely non-destructive. It can therefore be used upstream of production, during product life or as part of a failure analysis without altering the component.
Yes, as long as you adapt the parameters to the speed and requirements of the line. For R&D, expert appraisal or one-off quality control, tomography is ideal for checking the internal conformity of parts, without the extra cost of destroying them.
Absolutely. It allows the origins of an electronic fault to be investigated without dismantling: a soldering defect, crack, internal short-circuit, positioning error, etc. This saves time and increases precision in identifying the root causes.
